Copenhagen, Denmark |
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I turn messy hardware into stable, shippable products — fast, clean, compliant.
I’m an independent engineer and inventor. I design mechanisms and 3D-printed tooling, integrate and validate processes,
and take systems from lab to high-volume production.
My edge: I’m a printing-systems specialist across modalities — inkjet, screen/stencil,
photolithography, PCB manufacturing (paste/stencils), photographic printing, and 3D printing — spanning chemistry, mechanics, and control.
Why people bring me in
- You need a working prototype from zero — define the concept, build it, make it testable.
- A concept works in the lab, then fails on the line.
- Printing processes don’t repeat because the process window is not defined or controlled (ink/paste/geometry/registration).
- Yield is falling and firefighting never stops.
- Supplier/OSAT transfer stalls because procedures differ by site.
- A device must be designed to assemble first time and be serviceable on day 1000.
Proof at a glance
- 10+ years; contribution to 1M+ shipped units.
- 12 patents, 19 papers (ACS Nano, Advanced Functional Materials, Nanoscale, Scientific Reports).
- Built small teams; transferred tech to external manufacturing without drama.
Highlights
More info
- Advanced-packaging platforms taken to stable series production; fewer escapes, faster transfers.
- Minutes-long inspection collapsed to seconds with purpose-built rigs and clean data capture.
- Printed & flexible electronics (R2R): functional batches with inline/rapid checks and predictable hand-off.
- Early career: pilot catalytic clean-up at aluminum plants → ~20% emission reduction.
Unique capability — Printing systems (end-to-end)
- Inkjet: inks/substrates, waveform & drop control, wetting/leveling, sinter/cure, registration.
- Screen/Stencil: mesh/emulsion, squeegee dynamics, paste rheology, aperture/land, snap-off & release.
- Photolithography: resist stack, exposure/develop windows, alignment & CD, defect modes.
- PCB (paste & patterns): stencil design/step-downs, print→reflow hand-off, cleanliness & solderability.
- Photographic printing: exposure/chemistry discipline for repeatable tone/contrast.
- 3D printing (DfAM): orientation, tolerances/fits, heat-set inserts, post-process effects on dimensions.
Result: engineered windows, reliable registration, clean adhesion/cure, inline checks that catch the right things.
Selected stories (from new to repeatable to scalable)
Zero to working prototype — nothing existed yesterday.
I clarified constraints, shaped two concept options, built a quick CAD, printed/assembled the first unit, and wrote a simple test plan.
Outcome: a real, testable prototype (not a render), faster decisions, clear path to NPI.
Prototype that refused to become a product — it worked with “hero” operators and died with the real crew.
I set the process architecture, defined split plans, built a validation pack (installation/operational/performance), and ran a golden build with acceptance.
Outcome: stable ramp with regular operators, fewer redesign loops, earlier first revenue.
Printed features that wouldn’t behave — bridges, voids, and opens across a stencil/screen print step.
I re-designed apertures and step-downs, tuned paste rheology and squeegee dynamics, set snap-off and wipe cadence, and aligned reflow profiles with print limits.
Outcome: first-pass yield up; bridges/opens down; a stable print window documented for operators and suppliers.
Yield on the edge — shipments were slipping; AOI called false rejects; rework piled up.
I mapped the two biggest defect modes, ran a focused DOE, locked the window, and rewrote run-cards and operator checklists.
Outcome: +14% yield in six weeks, −40% escapes, predictable output.
Tooling that pays for itself — assembly and inspection were slow and noisy.
I delivered three fixtures with usage SOPs, acceptance criteria, and a spares kit; integrated quick checks into the line.
Outcome: minutes → seconds on critical steps; cleaner data; escapes down.
Transfer that wouldn’t transfer — every site did it “their way,” and the calendar kept burning.
I produced the documentation pack (run-cards, SOPs, control plan), set maturity gates, trained operators, and closed first-article sign-off.
Outcome: clean hand-off, consistent behavior across sites, fewer back-and-forths.
Printed & flexible electronics, without the mess — learning cycles were too long and measurements drifted.
I produced a functional batch, set up rapid/inline checks, and defined acceptance metrics with simple charts the team actually used.
Outcome: quicker learning and a smooth hand-off to pilot.
From idea to funded — strong concept, weak narrative.
I aligned the call, shaped work-packages and budget logic, added impact metrics, and built a Q&A deck; coached the presentation.
Outcome: higher review scores, funding secured, confident defense to stakeholders.
How I help (prioritized)
- Zero-to-first prototype (concept → build → test)
You get: clarified requirements, concept options, quick CAD, a working prototype, a test plan, and a short report with next steps.
Result: a real, testable unit; faster decisions; clear path to pilot/NPI.
- NPI that survives production (lab → line)
You get: process architecture, split plan, validation pack (IQ/OQ/PQ), golden build & acceptance.
Result: predictable ramp; fewer redesign loops; earlier revenue.
- Cross-modal printing system tune-up
You get: a window for your print (ink/paste/geometry), a registration plan, acceptance metrics, and operator checklists.
Result: repeatable prints, clean adhesion/cure, fewer defects carried downstream.
- Stop-the-bleed yield fix
You get: Pareto, control plan with limits, updated run-cards, operator checklist.
Result: double-digit yield lift; fewer escapes; firefighting stops.
- Devices & mechanisms (DfAM)
You get: CAD with tolerances & inserts, orientation spec, serviceability notes, BOM + drawings, one prototype.
Result: first-time assembly; reduced rework; faster iteration.
- Tooling that pays for itself (fixtures / jigs / test rigs)
You get: 1–3 fixtures/rigs, usage SOP, acceptance criteria, spares list.
Result: minutes → seconds; cleaner data; fewer escapes.
- Grants, proposals & defense
You get: call alignment, work-packages, budget & justification, impact metrics, Q&A deck, pitch rehearsal.
Result: higher win rate; smoother reviews; confident board/customer presentations.
- Supplier / OSAT transfer that holds
You get: documentation pack, maturity gates, training, first-article sign-off.
Result: clean hand-off; stable output — the fastest path to scale.
Work history — last 15 years
Full timeline on LinkedIn
- Senior Process Engineer — Demant · Copenhagen · 2022–2025
- Brought advanced microelectronic assemblies to series production; standardized validation and monitoring; stabilized stencil/print → reflow hand-off.
- Accelerated transfer to external manufacturing; stabilized yield and reduced escapes.
- Research Fellow — Fraunhofer EMFT · Munich · 2019–2022
- R2R/flexible electronics: delivered 1000+ functional prototypes/year; seconds-level inspection.
- Built test rigs and complete transfer packs for external production.
- R&D Engineer — IsItFresh · Aachen · 2017–2019
- Printed gas-sensor holders, calibration jigs, packaging prototypes; halved calibration labor.
- Linked geometry/process to sensor performance; moved designs to pilot production.
- Lead Researcher — ITMO University · St. Petersburg · 2015–2017
- Built an inkjet/optical-materials lab; led a 5-person team; patents and industry hand-offs.
- Researcher — Institute of Silicate Chemistry, RAS · St. Petersburg · 2012–2015
- Developed new zeolite syntheses; designed hydrothermal equipment (≈3 weeks → ≈1 week).
- Research Engineer — RUSAL · Various sites · 2010–2011
- Pilot catalytic gas-cleanup on aluminum plants; ~20% emission reduction on trials.
Publications & patents (highlights)
- 19 peer-reviewed papers (ACS Nano, Advanced Functional Materials, Nanoscale, Scientific Reports).
- 12 international patents (optical materials, inks, security printing, electronics).
- →Full list
Ready to move?
If you need a prototype from zero, a process that survives production, or a yield fix that sticks — I’m your person.
Send me one short email — tomorrow is fine:
- What must work and by when (one sentence + hard constraint).
- Top 3 failures/risks (or why it keeps failing).
- Decision date + rough budget (a ballpark is enough).
What you get back (quickly):
- A clear assessment of the problem and the fastest credible path.
- A consultation to sanity-check assumptions and align on constraints.
- A simple fit check — if I’m not the right person, I’ll point you to someone better.
- A lightweight proposal with first deliverables and scope.
Let’s talk